synth_tools

Back

RND 205-00005 pitch 5mm Varistor, diameter 7mm, width 4.2mm, pitch 5mm size 15x12.6mm^2 drill 1.3mm pad 2.5mm terminal block Metz Connect Type011_RT05502HBWC pitch 5mm Varistor, diameter 12mm, width 4.8mm, pitch 5mm size 45x9.8mm^2 drill 1.3mm pad 2.5mm terminal block (Script generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 24 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation CB), generated with kicad-footprint-generator ipc_gullwing_generator.py 20-Lead Plastic Quad Flat, No Lead Package - 10x10x0.9 mm Body [TQFP] With Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Quad Flat, No Lead Package - 9x9 mm Body [WSON], http://www.ti.com/lit/ml/mpds421/mpds421.pdf WSON-16 3.3 x 1.35mm Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments (http://www.ti.com/lit/ds/symlink/tps22993.pdf QFN, 24 Pin (http://www.ti.com/lit/ds/symlink/pca9548a.pdf#page=37), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-103-02-xxx-DV-BE, 3 Pins per row (http://www.molex.com/pdm_docs/sd/428192214_sd.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF11-14DP-2DSA, 7 Pins per row (http://www.molex.com/pdm_docs/sd/530470610_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 44-Lead Plastic Quad Flat, No Lead Package (MD) - 4x4x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic Dual Flat, No Lead Package, 1.2x1.8x1.55 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Shrink Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Shrink Small Outline (SN) - Narrow, 3.90 mm Body [UDFN] (See http://www.onsemi.com/pub/Collateral/NLSV2T244-D.PDF dfn udfn dual flat OnSemi VCT, 28 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0108.PDF), generated with kicad-footprint-generator SMD capacitor, aluminum electrolytic nonpolar, 6.3x5.8mm SMD capacitor, aluminum electrolytic, Panasonic C5, 6.3x4.9mm SMD capacitor, aluminum electrolytic, Nichicon, 4.0x4.5mm SMD capacitor, aluminum electrolytic, Nichicon, 3.0x5.4mm SMD capacitor, aluminum electrolytic, Nichicon, 8.0x6.2mm SMD capacitor, aluminum electrolytic, Nichicon, 8.0x5.4mm SMD capacitor, aluminum electrolytic, Nichicon, 6.3x3.9mm SMD capacitor, aluminum electrolytic, Nichicon, 6.3x5.8mm SMD capacitor, aluminum electrolytic, Panasonic C5, 6.3x4.9mm SMD capacitor, aluminum electrolytic nonpolar, 4.0x5.4mm SMD capacitor, aluminum electrolytic, Nichicon, 3.0x5.4mm SMD capacitor, aluminum electrolytic, Nichicon.

New Pull Request

Labels Milestones