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Power Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 42-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 6-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket THT DIP DIL PDIP SMDIP 2.54mm 7.62mm 300mil Three phase, Bridge, Rectifier 4-lead round diode bridge Vishay KBU rectifier package, 5.08mm pitch, single row style2 pin1 right Through.

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