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Package; 40 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot190-1_po.pdf VSSOP-8 2.3x2mm Pitch 0.5mm Fairchild-specific MicroPak2-6 1.0x1.0mm Pitch 0.35mm HVSON, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_TDFN_2x3_MNY_C04-0129E-MNY.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 20-Pin Plastic Quad Flat No-Lead Package, 3x3mm Body (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin.

8.842057e+00 vertex -1.065849e+02 9.665134e+01.
-0.892525 7.76535 facet normal -0.0376919 0.272942.

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