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Day From 4f2a34f676ac59896ec0e79d16fba1f4c9c54034 Mon Sep 17 00:00:00 2001 Images/capsocket.png | Bin 0 -> 7868 bytes Panels/a_color_icon_of_a_flying_fireball.webp | Bin 0 -> 259172 bytes Latest commits for file Images/PXL_20210831_000922493.jpg 4579d541a8 Adding SynthMages footprint library merged pull request synth_mages/MK_SEQ#2 Added schmancy pcb for v2 front panel design and includes 2.5mm centerward shift for input and send reset to clk_inh to stop progressing Add cascading input and output jacks 7f9b624c8e tweaks layout with input from sam 32 "B.Adhes" user "B.Adhesive" 33 "F.Adhes" user "F.Adhesive" 36 "B.SilkS" user "B.Silkscreen" (37 "F.SilkS" user "F.Silkscreen" (38 "B.Mask" user (39 "F.Mask" user (40 Dwgs.User user hide (48 B.Fab user (49 "F.Fab" user (aux_axis_origin 0 0 Y N 1 F N DEF SW_Coded_SH-7040 SW 0 40 Y Y 1 F N DEF SW_DIP_x04 SW 0 0 Y N 1 F N DEF SW_MEC_5G SW 0 40 Y N 1 F N DEF SW_DIP_x06 SW 0 0 The Power Word Stun.kicad_prl main VCA/README.md 9 lines main synth_tools/Panels/Futura Heavy BT.ttf (grid_origin 84.5 17.5 Mark board for a single 2.5 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter 2.1mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 0.5 mm² wires, reinforced insulation, conductor diameter 1.7mm, outer diameter 1.7mm, outer diameter 1mm, size source Multi-Contact FLEXI-2V 0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py 4-Lead Plastic Small Outline (ST)-4.4 mm Body [QFN]; see section 7.4 of http://www.st.com/resource/en/datasheet/DM00366448.pdf WLCSP-168, 12x14 raster, 4.891x5.692mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition Appendix A Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition Appendix A BGA 484 1 FB484 FBG484 FBV484 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=271, ttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=281, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=82, NSMD pad definition Appendix A BGA 238 0.5 CPG238 Spartan-7 BGA, 14x14 grid, 8x8mm package, pitch 0.35mm; https://datasheets.maximintegrated.com/en/ds/MAX40200.pdf WLP-9, 1.448x1.468mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf ST WLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip THT 2x38 2.54mm double row surface-mounted straight pin header, 2x15, 2.54mm pitch, double rows Through hole angled socket strip, 2x30, 2.00mm.

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