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ST WLCSP-90, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.55mm Pitch, https://www.dialog-semiconductor.com/sites/default/files/da1469x_datasheet_3v1.pdf#page=740 VFBGA-100, 10x10, 7x7mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/DM00257211.pdf WLCSP-49, 7x7 raster, 3x3mm package, pitch 0.8mm; see section 7.1.1 of http://www.st.com/resource/en/datasheet/stm32f401ce.pdf WLCSP-49, 7x7 raster, 3x3mm package, pitch 0.8mm Altera BGA-68 M68 MBGA Altera BGA-153 M153 MBGA Altera BGA-153 M153 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on http://www.latticesemi.com/view_document?document_id=213 BGA 0.8mm 9mm 121 BGA-132 11x17 12x18mm 1.0pitch Altera BGA-144 M144 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 8.9 mm (350 mils), SMDSocket, LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 6x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 28-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 9.78x22.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 8x-dip-switch SPST Copal_CHS-08B, Slide, row spacing 7.62 mm (300 mils), body size 9.78x7.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 12x-dip-switch SPST CTS_Series194-12MSTN, Piano, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil 3-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil Socket 4-lead though-hole mounted DIP package, row spacing 10.16 mm.

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