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Of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Thin Shrink Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 28-lead though-hole mounted DIP package, row spacing.

• 0.5 R-XBGA-N12 Texas Instruments, DSBGA, area grid, YBG.
• Normal -0.532832 -0.843291 -0.0703581 vertex -3.81128 9.2209.
• 0.881899 2.92089e-06 facet normal -8.884378e-01 -4.589969e-01.

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