Labels Milestones
BackBody [VDFN] (see Microchip Packaging Specification 00000049BS.pdf UQFN, 20 Pin (https://sensirion.com/media/documents/C4B87CE6/627C2DCD/CD_DS_SCD40_SCD41_Datasheet_D1.pdf), generated with kicad-footprint-generator connector JST SHL series connector, 502382-0970 (http://www.molex.com/pdm_docs/sd/5023820270_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 4 times 0.127 mm² wires, reinforced insulation, conductor diameter 2.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.25 mm² wire, reinforced insulation, conductor diameter 1.25mm, outer diameter 1.7mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py SO, 8 Pin (https://www.monolithicpower.com/en/documentview/productdocument/index/version/2/document_type/Datasheet/lang/en/sku/MP2303A/document_id/494#page=14), generated with kicad-footprint-generator Molex.
- Body [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 SSO.
- Extra Design rules: Smallest drillable hole size.