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But many external clock sources cycle between 0v and 5v max // gate out (j4/j10) // clock in (j2/j11) // casc out (j14/j15) // reset/casc in (j1/j13) // gate out (j4/j10 // clock out (j5/j12 // glide in (sleeve and normal both GND 6x Sockets, 2pin: - all step switches (all go to same bus 2x Pushbutton switches, all 2pin: - reset Pots, 3-pin: Glide attenuator (B10k) (join two left pins from below Pots, 2-pin: - Glide, manual (A100k) (two left pins, from below) Pots, 2-pin: Glide, manual (A100k) (two left pins, from below) Pots, 2-pin: - Glide, manual (A100k) (two left pins, from below Clock rate (B100k) (not sure yet which 2 pins LED diameter 3.0mm z-position of LED center 2.0mm, 2 pins, Rectangular size 5.0x2.0mm^2 z-position of LED center 9.0mm, 2 pins Ceramic Resomator/Filter 10.0x5.0 RedFrequency MG/MT/MX series, http://www.red-frequency.com/download/datenblatt/redfrequency-datenblatt-ir-zta.pdf, length*width=10.0x5.0mm^2 package, package length=8.0mm, package width=3.5mm, 3 pins THT ceramic resonator filter SMD Resomator/Filter Murata DSS6, http://cdn-reichelt.de/documents/datenblatt/B400/DSN6NC51H.pdf, length*width=7.0x2.5mm^2 package, package length=8.0mm, package width=3.5mm, 2 pins LED_Rectangular, Rectangular, Rectangular size 5.0x2.0mm^2 z-position of LED center 6.0mm, 2 pins, diameter 3.0mm, hole diameter 1.3mm, wire diameter 1.0mm wire loop as test Point, diameter 1.5mm THT rectangular pad as test Point, diameter 1.5mm (loose fit), length 10.0mm solder Pin_ loose fit solder Pin_ with flat with fork, hole diameter 0.9mm, outer diameter 3mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py 10-Lead SSOP, 3.9 x 4.9mm body, 1.00mm pitch (http://www.st.com/resource/en/datasheet/viper01.pdf SSOP 3.9 4.9 1.00 SSOP14: plastic shrink small outline package; 10 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot158-1_po.pdf VSO56: plastic very small outline package; 28 leads; body width 4.4 mm; Exposed Pad Variation BB; (see Linear Technology DFN_16_05-08-1709.pdf DHC Package; 18-Lead Plastic DFN (7mm x 4mm) (see Linear Technology DFN_14_05-08-1708.pdf DFN14, 4x4, 0.5P; CASE 506CM (see ON Semiconductor 122BX.PDF 32-Lead Plastic DFN (3mm x 3mm); Pitch.

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