Labels Milestones
BackPitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=265, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 2x4 (perimeter) array, NSMD pad definition Appendix A BGA 238 0.5 CP236 CPG236 Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=276, NSMD pad definition Appendix A BGA 238 0.5 CP236 CPG236 Artix-7 BGA, 16x16 grid, 17x17mm package, 0.8mm.
- Normal 0.367742 -0.111553 0.923213 vertex 2.55704 8.58402.
- LFCSP, 6 Pin (https://www.onsemi.com/pdf/datasheet/ncp349-d.pdf#page=12), generated with kicad-footprint-generator Samtec.
- -2.985593e+000 1.747200e+001 facet normal 5.127229e-14 -1.000000e+00.
- Small outline package; 44 leads.