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10-Lead SSOP, 3.9 x 4.9mm body, 1.00mm pitch (http://www.st.com/resource/en/datasheet/viper01.pdf SSOP 3.9 4.9 1.00 SSOP14: plastic shrink small outline package; 10 leads; body width 3.9 mm; lead pitch 0.635; (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Horizontal RM 2.54mm TO-220-4, Vertical, RM 0.9mm, staggered type-1 TO-220F-15 Vertical RM 10.9mm TO-247-2, Vertical, RM 10.9mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-2 Horizontal RM 2.54mm TO-220F-4, Horizontal, RM 0.97mm, Multiwatt-9, staggered type-1 TO-220-5, Vertical, RM 10.9mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-3 Vertical RM 5.475mm SOT-93 TO-218-3, Vertical, RM 1.7mm, Pentawatt, Multiwatt-5, staggered type-1, see http://www.st.com/resource/en/datasheet/l298.pdf TO-220-15 Vertical RM 1.7mm IIPAK I2PAK TO-262-5, Vertical, RM 10.9mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-2 Vertical RM 5.45mm TO-46-2, Pin2 at center of package, Thorlabs photodiodes, https://www.thorlabs.de/drawings/374b6862eb3b5a04-9360B5F6-5056-2306-D912111C06C3F830/FDGA05-SpecSheet.pdf TO-92 leads molded, narrow, drill 0.75mm (see NXP sot054_po.pdf TO-92 leads molded, narrow, drill 0.75mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 6x-dip-switch SPST CTS_Series194-6MSTN, Piano, row spacing 15.24 mm (600 mils 32-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 14-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 14-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 42-lead though-hole mounted DIP package, row spacing.

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