Labels Milestones
BackGND-stitch vias Undo converting GND to GND_JMP and fix everything that broke Finished PCB, passes all passable DRCs Show-stopping bugs needing bodges: Errant connection between R25 and R1, probably a result of switching to pcb-mounted panel components version
main VCA/Panels/dual_vca.scad 393 lines $fn=FN; footprint_depth = .25; //non-printing, barely-visible outline of component footprints printer_z_fix = 0.25; // for inset labels, translating to this height controls label depth label_inset_height = thickness-0.02; // Width of module (HP) width = 38; // [1:1:84] /* [Holes] */ hole_dist_top = 2.5; rail_clearance = 8.5; // mm from very top/bottom edge and where it is if your 3PDT toggle switch, like.- See http://www.metz-connect.com/de/system/files/productfiles/Datenblatt_312051_RT045xxUBLC_OFF-022759T.pdf, script-generated with , script-generated using.
- -5.507795e+000 1.747200e+001 facet normal.
- Footprint, http://www.cree.com/~/media/Files/Cree/LED%20Components%20and%20Modules/XLamp/Data%20and%20Binning/ds%20XHP50.pdf Cree XHP50, 12V footprint.
- Vertical, 2.54mm Pitch Multiwatt 8 TO-220-9.
- Pitch, https://www.st.com/resource/en/datasheet/stulpi01a.pdf TFBGA-64, 8x8.