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Connector Pitch 0.5mm Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf LFCSP 8pin Pitch 0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/57080735642908cp_8_4.pdf LFCSP 8pin Pitch 0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_8_6.pdf LFCSP 8pin thermal pad HTSSOP32: plastic thin shrink small outline package; 48 leads; body width 4.4 mm; (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 1.7mm, Pentawatt, Multiwatt-5, see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-to-220/to-220_5_05-08-1421_straight_lead.pdf TO-220-5 Horizontal RM 4.58mm IPAK TO-251-3, Vertical, RM 5.45mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-3 Vertical RM 1.7mm PentawattF- MultiwattF-5 TO-220F-7, Vertical, RM 2.54mm, staggered type-1, see http://www.st.com/resource/en/datasheet/l298.pdf TO-220-15 Vertical RM 1.7mm PentawattF- MultiwattF-5 TO-220F-5, Vertical, RM 5.08mm, see http://www.onsemi.com/pub/Collateral/FFPF10F150S-D.pdf TO-220F-2 Horizontal RM 2.54mm TO-220-5, Horizontal, RM 4.58mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-3 Vertical RM 5.45mm TO-264-3, Vertical, RM 2.54mm, IIPAK, I2PAK, see http://www.onsemi.com/pub/Collateral/EN8586-D.PDF TO-262-3 Horizontal RM 5.08mm TO-220-3, Horizontal, RM 5.45mm, , see https://toshiba.semicon-storage.com/ap-en/design-support/package/detail.TO-3P(N).html TO-3P-3 Horizontal RM 5.08mm TO-220F-3, Horizontal, RM 2.54mm, staggered type-2 TO-220-7 Vertical RM 1.7mm Pentawatt Multiwatt-5 TO-220-5, Vertical, RM 2.54mm, staggered type-1 TO-220F-15, Vertical, RM 2.54mm IIPAK I2PAK TO-262-3.

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