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- 6x5 mm Body with Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 48 leads; body width 4.4 mm; Exposed Pad Variation; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot361-1_po.pdf TSSOP, 28 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8008S.pdf#page=16), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, old mpn/engineering number: 1-794107-x, 11 Pins.

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