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Connector, S18B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-103-02-xxx-DV-BE-LC, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 40 Pin (JEDEC MO-153 Var JC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_noLead_generator.py DFN6 3*3 MM, 0.95 PITCH; CASE 506AH-01 (see ON Semiconductor 506BU.PDF 8-Lead Plastic Dual Flat, No Lead Package - 3x3 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf SSOP, 32 Pin (https://www.nxp.com/docs/en/package-information/SOT617-1.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, BM11B-GHS-TBT (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator JST XH series connector, SM02B-ZESS-TB (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-134-02-xxx-DV-A, 34 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 3, Wuerth electronics 9774020982 (https://katalog.we-online.de/em/datasheet/9774020982.pdf), generated with kicad-footprint-generator Hirose DF12C SMD, DF12C3.0-30DS-0.5V, 30 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/), generated with kicad-footprint-generator JST GH top entry Molex MicroClasp Wire-to-Board System, 55932-0910, with PCB locator, 3 Pins per row (https://www.hirose.com/product/en/products/DF63/), generated with kicad-footprint-generator Soldered wire connection, for 6 times 0.15 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0930, 9 Pins (http://www.molex.com/pdm_docs/sd/559320530_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 4.5mm, height 4, Wuerth electronics 9774010633 (https://katalog.we-online.com/em/datasheet/9774010633.pdf), generated with kicad-footprint-generator JST SHL.

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