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WLCSP-132, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, ST die ID 461, 4.63x4.15mm, 115 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100489.PDF WLCSP-25, 5x5 raster, 2.423x2.325mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l151cc.pdf WLCSP-64, 8x8 raster, 3.623x3.651mm package, pitch 0.8mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l476me.pdf WLCSP-81, 9x9 raster, 4x4mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/DM00366448.pdf WLCSP-168, 12x14 raster, 4.891x5.692mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf WLCSP-64, 8x8 raster, 4.539x4.911mm package, pitch 0.5mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, ST die ID 480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, https://www.onsemi.com/pdf/datasheet/ncp163-d.pdf#page=23 6pin Pitch 0.4mm 8-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_14_05-08-1708.pdf DFN14, 4x4, 0.5P; CASE 506CM (see ON Semiconductor Micro8 (Case846A-02): https://www.onsemi.com/pub/Collateral/846A-02.PDF PSOP44: plastic thin shrink small outline 7,5mm long https://toshiba.semicon-storage.com/info/docget.jsp?did=53548&prodName=TLP2770 6-Lead Plastic DFN (7mm x 4mm) (see Linear Technology DFN_6_05-08-1703.pdf 6-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline (SN) - Narrow, 3.90 mm Body [TQFP] With 4.5x4.5 mm Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf DFN, 6 Pin (http://www.onsemi.com/pub/Collateral/NCP133-D.PDF), generated with kicad-footprint-generator ipc_gullwing_generator.py 6-pin SOT-23 package, Handsoldering SOT, 8 Pin (http://www.ti.com/lit/ml/mpds382b/mpds382b.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, 43915-xx14, With thermal vias in pads, 5 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0694-9-81&productname=DF12C(3.0)-50DS-0.5V(81)&series=DF12&documenttype=2DDrawing⟨=en&documentid=0000994748), generated with kicad-footprint-generator connector Molex MicroClasp Wire-to-Board System, 55932-1130, 11 Pins per row (https://www.molex.com/pdm_docs/sd/022057045_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 6, Wuerth electronics 97730256332.

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