Labels Milestones
Back3.3x3.3x1 mm Body [HTSSOP], with thermal pad HTSSOP32: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 932BH.PDF TQFP, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/60001477A.pdf (page 1083)), generated with kicad-footprint-generator ipc_gullwing_generator.py 8-Lead Plastic Stretched Small Outline Narrow.
- (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator.
- 55.88mm 11W length 50mm.
- TypMS Wuerth Power Inductor, Wuerth.
- (T1655-4)), generated with kicad-footprint-generator.
- Normal 0.0942884 -0.991507 0.0895734 facet.