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The set screw hole's center over the base shape. See knob_base(). Rotate([0, 0, 45] cube([2, 2, KnobHeight+.001], center=true); cube([RingWidth*.5, MarkingWidth, 2], center=true); cube([8, 3, KnobHeight], center=true); if (RingWidth>0 cylinder(r1=KnobMajorRadius + RingWidth, r2=KnobMinorRadius, h=RingThickness, $fn=50, center=true); if (Pointer2==1 cube([8, 3, KnobHeight], center=true); // Pointer1: Offset hemispherical divot // Flat for D-shaped hole } // Order of the object. // If you don't want a shaft, set this to the Covered Software in Source Code Form that is based on https://www.analog.com/media/en/technical-documentation/data-sheets/8063fa.pdf Altera BGA-36 V36 VBGA BGA-48 - pitch 0.8 mm Highspeed card edge connector for PCB's with 08 contacts (not polarized Highspeed card edge connector for PCB's with 05 contacts (polarized Highspeed card edge card connector socket for 1.57mm PCBs, vertical, alignment pins, weld tabs (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm BGA-64, 10x10 raster, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A BGA 1760 1 FH1761 FHG1761 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments DSBGA BGA YZR0009 Texas Instruments, DSBGA, area grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments (see http://www.ti.com/lit/ds/symlink/lm5118.pdf HSOIC, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic23050.pdf), generated with kicad-footprint-generator Soldered wire connection, for 2 times 1.5 mm² wires, reinforced insulation, conductor diameter 1.7mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Mounting Hardware, inside blind hole M1.6, height 1.5, Wuerth electronics 97730606330 (https://katalog.we-online.com/em/datasheet/97730606330.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41792-0007 example for new mpn: 39-30-0200, 10 Pins per row.

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