Labels Milestones
Back600mil LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 10-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 24-lead surface-mounted (SMD) DIP package, row spacing 6.15 mm (242 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 7x-dip-switch SPST KingTek_DSHP07TS, Slide, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 48-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD DIP DIL PDIP 2.54mm 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET ME MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET LA MOSFET Infineon DirectFET S3C MOSFET Infineon PLCC, 20 pins, through.
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