3
1
Back

TSOP-I, 40 Pin (http://www.ti.com/lit/ds/symlink/dac7750.pdf#page=54), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 5 times 0.1 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 1mm, size source.

New Pull Request