Labels Milestones
Back6-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 6-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 25.4mm 1000mil Socket 3M 16-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils 6-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300.
- Connector, FH12-17S-0.5SH, 17 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf.
- (https://toshiba.semicon-storage.com/info/docget.jsp?did=30523), generated with kicad-footprint-generator ipc_gullwing_generator.py.