Labels Milestones
BackIpc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l496wg.pdf ST WLCSP-132, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l412t8.pdf ST WLCSP-49, ST die ID 494, 3.3x3.38mm, 49.
- 1.29249 -3.16791 6.59 vertex -2.53508 1.69389.
- -0.0980171 1.13576e-06 facet normal -9.682993e-01 -2.497929e-01 0.000000e+00 facet.
- 55932-1210, with PCB locator, 2.
- 7.921225e-01 facet normal 0.152472 0.0366121 0.987629 vertex.