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18.4x8mm body (http://www.futurlec.com/Datasheet/Memory/628128.pdf), reverse mount TSOP I 32 reverse TSOP-I, 40 Pin (JEDEC MO-241/VAB, https://assets.nexperia.com/documents/package-information/SOT763-1.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 4, Wuerth electronics 9774025243 (https://katalog.we-online.de/em/datasheet/9774025243.pdf), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, FH12-45S-0.5SH, 45 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-4P-1.25DS%2820%29/), generated with kicad-footprint-generator Molex PicoBlade Connector System, 53048-0810, 8 Pins per row (http://www.molex.com/pdm_docs/sd/530470610_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-131-02-xxx-DV, 31 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-4P-1.25DS%2820%29/), generated with kicad-footprint-generator connector Molex MicroClasp Wire-to-Board System, 55932-1330, 13 Pins (http://www.molex.com/pdm_docs/sd/559320210_sd.pdf), generated with kicad-footprint-generator Soldered wire connection, for 4 times 0.25 mm² wire, basic insulation, conductor diameter 1.7mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 4 times 0.15 mm² wires, reinforced insulation, conductor diameter 2.4mm, outer diameter 1.7mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with.

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