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Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g031y8.pdf ST WLCSP-20.

Normal -0.816085 -0.545296 -0.191461.
Normal -0.920082 -0.0906197 0.381101 vertex 10.0771 -0.373379 2.58057.
Normal 0.49996 0.866048 8.13718e-05 facet normal -0.787433.
IMAGE.png and /dev/null differ a3d4f2b82e.
0.7G, https://www.vybronics.com/wp-content/uploads/datasheet-files/Vybronics-VZ30C1T8219732L-datasheet.pdf Broadcom LGA, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/MCP6V66-Family-Data-Sheet-DS20006266A.pdf#page=35), generated.

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