Labels Milestones

Back

Chip Scale Package - 3x3 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 32-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 64-lead though-hole.

• X 5.2mm), Pin 5-8 connected to EP.
• Normal -0.0366054 0.152473 0.987629 facet normal.
• -0.201286 0.235684 0.950756 facet normal.
• 52mm length 46mm width.

New Pull Request

0 Open 0 Closed

Label

Show archived labels

Use alt + click/enter to exclude labels

All labels No label

Milestone

All milestones No milestones

Project

All projects No project

0 Open 0 Closed

Close

Label

Clear labels

Milestone

No milestone

Projects

Clear projects