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Pitch (http://www.st.com/resource/en/datasheet/tda7264.pdf TO-220-9 Vertical RM 5.45mm TO-3PB-3, Vertical, RM 10.95mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-3 Vertical RM 1.7mm PentawattF- MultiwattF-5 TO-220F-5, Vertical, RM 2.54mm, staggered type-2 TO-220F-5 Vertical RM 2.54mm staggered type-1 TO-220F-9 Vertical RM 2.54mm staggered type-1 TO-220F-5 Vertical RM 1.7mm PentawattF- MultiwattF-5 TO-220F-5, Vertical, RM 1.7mm, PentawattF-, MultiwattF-5 TO-220F-5 Vertical RM 1.27mm staggered type-2 TO-220-11, Vertical, RM 1.27mm, Multiwatt-7, staggered type-1 TO-220F-5 Vertical RM 2.54mm staggered type-2 TO-220-15, Horizontal, RM 2.54mm, IIPAK, I2PAK, see http://pdf.datasheetcatalog.com/datasheet/irf/iris4011.pdf TO-262-5 Horizontal RM 5.45mm TO-247-4, Horizontal, RM 0.97mm, Multiwatt-9, staggered type-1 TO-220F-11, Vertical, RM 1.7mm, Pentawatt, Multiwatt-5, staggered type-2, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Vertical RM 1.7mm staggered type-2 TO-220-7 Horizontal RM 2.54mm IIPAK I2PAK TO-262-5, Horizontal, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 5.08mm 7.62mm 300mil 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 22.86mm 900mil SMDSocket SmallPads 40-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 48-lead though-hole mounted high-volatge DIP package (based on http://www.latticesemi.com/view_document?document_id=213 BGA 0.8mm 9mm 121 BGA-132 11x17 12x18mm 1.0pitch Altera BGA-144 M144 MBGA Altera UBGA U324 BGA-324 BGA-624, 25x25 grid, 21x21mm package, pitch 0.4mm; http://ww1.microchip.com/downloads/en/devicedoc/atmel-8235-8-bit-avr-microcontroller-attiny20_datasheet.pdf#page=208 WLCSP-16, 1.409x1.409mm, 16.

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