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Https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole socket strip SMD 1x05 1.00mm single row (from Kicad 4.0.7), script generated Through hole pin header SMD 1x06 2.54mm single row Through hole angled socket strip THT 1x28 2.54mm single row style1 pin1 left Surface mounted socket strip THT 1x05 1.27mm single row style1 pin1 left Surface mounted socket strip SMD 1x09 2.54mm single row Through hole straight socket strip, 2x33, 1.00mm pitch, 2.0mm pin length, single row (from Kicad 4.0.7), script generated Through hole IDC header, 2x32, 2.00mm pitch, single row style1 pin1 left Surface mounted socket strip SMD 1x13 2.00mm single row Through hole socket strip THT 1x16 1.00mm single row style1 pin1 left Surface mounted socket strip SMD 2x22 1.00mm double row Through hole angled pin header, 2x09, 2.00mm pitch, double rows Through hole angled pin header SMD 1x11 2.54mm single row style2 pin1 right Through hole straight pin header, 1x28, 1.27mm pitch, double rows Through hole angled pin header, 1x28, 1.27mm pitch, single row Surface mounted socket strip SMD 2x27 1.27mm double row Through hole socket strip THT 1x01 2.00mm single row Through hole straight Samtec HPM power header series 3.81mm post length, 1x08, 5.08mm pitch, single row Through hole socket strip SMD 1x03 2.54mm single row style2 pin1 right Through hole straight pin header, 2x06, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole pin header SMD 1x12 2.54mm single row male, vertical entry Harwin LTek Connector, 3 pins, pitch 5mm, size 80x9.8mm^2, drill diamater 1.3mm, pad diameter 2.1mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00045_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block Phoenix MKDS-1,5-9-5.08, 9 pins, pitch 5.08mm, size 10.2x11mm^2, drill diamater 1.2mm, pad diameter 2.1mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 2 times 0.25 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP I, 28 pins, 18.8x8mm body, 0.55mm pitch, IPC-calculated pads (http://ww1.microchip.com/downloads/en/devicedoc/doc0807.pdf TSOP I 32 reverse TSOP-I, 40 Pin (JEDEC MO-153 Var JC-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0230, 23 Circuits (http://www.molex.com/pdm_docs/sd/5022502391_sd.pdf), generated with kicad-footprint-generator connector wire 0.5sqmm double-strain-relief Soldered wire connection, for 4 times 0.75 mm² wires, reinforced insulation, conductor.

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