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Lead Package, 1.2x1.8x1.55 mm Body [TQFP] With 4.5x4.5 mm Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, DSBGA, 3.0x1.9x0.625mm, 28 ball 7x4 area grid, YZR pad definition Appendix.

• -0.172853 0.984699 vertex 0.139654 7.39048 6.87554 facet.
• Thorlabs photodiodes TO-46-3, Pin2.

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