Labels Milestones
BackModule wireless zigbee 802.15.4 flash crypto ATSAMR21G18 AT45DB041E TECC508A U.Fi Class 4 Bluetooth Module with on-board components Added hard sync to schematic, laid out PCB with exploratory 8hp layout 2x Sockets, all three pins need wires: glide in (sleeve and normal both GND Glide attenuator (B10k) (join two left pins from below) - Clock rate (B100k) (not sure yet which 2 pins diameter 3.0mm z-position of LED center 9.0mm, 2 pins diameter 5.0mm z-position of LED center 6.0mm 2 pins Rectangular size 3.9x1.9mm^2 2 pins LED, , diameter 1.8mm size 1.8x2.4mm^2 z-position of LED center 2.0mm, 2 pins, pitch 3.5mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection, for 3 times 0.75 mm² wires, basic insulation, conductor diameter 0.4mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Hirose series connector, 502382-0870 (http://www.molex.com/pdm_docs/sd/5023820270_sd.pdf), generated with kicad-footprint-generator JST SUR series connector, B22B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 0.127 mm² wires, basic insulation.
- One is easy hole_bottom .
- Core with bobbin, 10 pin, 3.81mm.
- User drawings Hardware/PCB/precadsr/potsetc.sch | 533.
- 0.0148301 -0.995037 vertex -8.75889 -4.81524 0.0476956 vertex.