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XP_POWER IHxxxxS SIP DCDC-Converter XP_POWER ITXxxxxSA, SIP, (https://www.xppower.com/pdfs/SF_ITX.pdf), generated with kicad-footprint-generator JST XA series connector, SM09B-ZESS-TB (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-148-02-xxx-DV-A, 48 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 42 Pin https://content.u-blox.com/sites/default/files/NINA-B1_DataSheet_UBX-15019243.pdf#page=30 NINA ublox u-blox b111 bluetooth nrf52840 module Omron Relay, SPST, https://gfinder.findernet.com/assets/Series/355/S32EN.pdf Finder 32.21-x300 Relay SPST Schrack-RP-II/1 RM3.5mm 8A 250V AC Form C http://image.schrack.com/datenblaetter/h_rp810012-b.pdf Relay SPST Schrack-RP3SL RM5mm 16A 250V AC Relay Relay SPST Schrack-RP-II/1 RM5mm 16A 250V AC Form C http://image.schrack.com/datenblaetter/h_rp810012-b.pdf Relay SPST High Capacity Relay, SPST-NO Form A, vertical mount, 6A, 5-60V, https://www.fujitsu.com/sg/imagesgig5/ftr-ly.pdf relay SPDT form c vertical Omron Relay, SPDT, https://gfinder.findernet.com/assets/Series/355/S32EN.pdf Relay SPDT, http://www.omron.com/ecb/products/pdf/en-g5le.pdf Relay SPDT Finder 40.11, https://www.finder-relais.net/de/finder-relais-serie-40.pdf Relay DPDT IM-relay FRT5 Kemet signal relay, DPDT, non-latching, single coil latching surface mount PLCC, 84 pins, surface mount PLCC, 28 pins, through hole 3.3mm, height 10, Wuerth electronics 9774010943 (https://katalog.we-online.de/em/datasheet/9774010943.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1510, with PCB cutout, light-direction upwards, see https://www.everlight.com/file/ProductFile/ITR1201SR10AR-TR.pdf reflective opto couple photo coupler package for Everlight ITR8307 with PCB locator, 11 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator JST PH series connector, BM03B-ZESS-TBT (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die ID 480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.55mm Pitch, https://www.dialog-semiconductor.com/sites/default/files/da1469x_datasheet_3v1.pdf#page=740 VFBGA-100, 10x10, 7x7mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l476me.pdf WLCSP-81, 9x9 raster, 4.4084x3.7594mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f103tb.pdf LFBGA-144, 12x12 raster, 7x7mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=294, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=90, NSMD pad definition Appendix A BGA 400.

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