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Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with missing pin 5, row spacing 7.62 mm (300 mils), body size 9.78x30.12mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 8x-dip-switch SPST CTS_Series194-8MSTN, Piano, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil 3-lead though-hole mounted DIP package, row spacing 5.9 mm (232 mils), body size 10.8x32.04mm.

• For: GMSTBVA_2,5/11-G-7,62; number of pins: 09; pin.
• -0.223445 0.736593 -0.63836 facet.
• -1.000000e+00 7.056682e-14 facet normal 0.681162 -0.725368.
• Normal -3.544499e-15 -2.713367e-15 1.000000e+00.
• 0.000664863 0.116361 -0.993207 vertex 1.02637 5.38893 21.833.

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