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43160-2104, With thermal vias in pads, 2 Pins per row (https://www.hirose.com/product/document?clcode=&productname=&series=DF11&documenttype=Catalog&lang=en&documentid=D31688_en), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1330.

• Pin, 4x4mm, 2.1mm sq.
• Mounting holes distance 47.1mm 44-pin D-Sub.

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