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THT 2x02 2.00mm double row Through hole angled pin header, 1x31, 2.00mm pitch, double rows Through hole socket strip SMD 2x32 1.00mm double row Through hole IDC box header, 2x06, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip SMD 1x08 1.27mm single row style1 pin1 left Surface mounted pin header SMD 2x04 2.00mm double row Through hole angled socket strip SMD 1x34 1.00mm single row Surface mounted socket strip SMD 1x05 1.00mm single row Through hole straight pin header, 2x34, 2.00mm pitch, 4.2mm pin length, single row Surface mounted socket strip SMD 1x38 1.00mm single row Through hole straight pin header, 2x12, 1.00mm pitch, single row Through hole straight socket strip, 2x36, 2.54mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole angled pin header SMD 2x09 1.27mm double row surface-mounted straight pin header, 1x30, 2.00mm pitch, 6.35mm socket length, single row Through hole socket strip SMD 1x32 1.27mm single row Through hole socket strip THT 1x36 2.54mm single row style1 pin1 left Surface mounted pin header THT 2x33 2.54mm double row surface-mounted straight socket strip, 1x36, 2.00mm pitch, single row Through hole straight pin header, 2x15, 1.00mm pitch, 2.0mm pin length, single row Through hole angled pin header THT 2x04 1.27mm double row Through hole IDC header, 2x13, 1.27mm pitch, 3.9x4.9mm body, exposed pad, 4x4mm body, pitch 0.5mm UFBGA-64, 8x8 raster, 3.347x3.585mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f031k6.pdf WLCSP-25, 5x5 raster, 2.133x2.070mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf UFBGA-144, 12x12 raster, 7x7mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 20x20 grid, 17x17mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77, NSMD pad definition Appendix A BGA 1924 1 FL1925 FLG1925 FL1926 FLG1926 FL1928 FLG1928 FL1930 FLG1930 Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 3x4 (perimeter) array, NSMD pad definition Appendix A BGA 1156 1 FF1157 FFG1157 FFV1157 FF1158 FFG1158 FFV1158 Virtex-7.

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