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BackPlastic SO, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments EUK 7 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, single row style1 pin1 left Surface mounted socket strip THT 2x27 2.00mm double row Through hole angled pin header SMD 2x20 1.27mm double row Through hole angled socket strip SMD 1x02 1.27mm single row (from Kicad 4.0.7), script generated Through hole Samtec HPM power header series 3.81mm post length THT 1x13 2.54mm single row style1 pin1 left Surface mounted pin header THT 2x21 2.54mm double row surface-mounted straight socket strip, 2x32, 2.00mm pitch, single row Surface mounted.
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