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Pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=305, NSMD pad definition Appendix A BGA 324 0.8 GateMate FPGA Maxim WLP-12, W121H2+1, 2.008x1.608mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/sn74lvc1g17.pdf#page=42, https://www.ti.com/lit/ml/mxbg018l/mxbg018l.pdf BGA 5 0.5 YZP Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 3x3 (perimeter) array, NSMD pad definition Appendix A Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition Appendix A BGA 324 0.8 CSGA324 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments (see http://www.ti.com/lit/ds/symlink/lm5118.pdf HSOIC, 8 Pin (http://www.winbond.com/resource-files/w25q32jv%20revg%2003272018%20plus.pdf (page 68)), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 53047-0610, 6 Pins per row (http://www.molex.com/pdm_docs/sd/530470610_sd.pdf), generated with kicad-footprint-generator Soldered wire connection, for 6 times 0.15 mm² wires, reinforced insulation, conductor diameter 0.5mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Mounting Hardware, inside through hole M1.6, height 4, Wuerth electronics 9774130360 (https://katalog.we-online.de/em/datasheet/9774130360.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-133-02-xx-DV-PE-LC, 33 Pins per row (https://www.hirose.com/product/document?clcode=&productname=&series=DF11&documenttype=Catalog&lang=en&documentid=D31688_en), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.25mm, height 4, Wuerth electronics 9774050482 (https://katalog.we-online.de/em/datasheet/9774050482.pdf), generated with kicad-footprint-generator JST ZE series connector, BM05B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00002304A.pdf (page 43)), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 30 Pin (JEDEC MO-241/VAB.

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