Labels Milestones
BackPad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, 4x4mm body, pitch 0.5mm (http://www.analog.com/media/en/package-pcb-resources/package/56702234806764cp_24_3.pdf, http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5801.pdf LFCSP VQ, 24 pin, exposed pad: 4.5x8.1mm, with thermal vias in pads, 3 Pins per row (https://www.hirose.com/product/en/products/DF63/), generated with kicad-footprint-generator.
- MKDS-3-14-5.08 pitch 5.08mm size 10.2x8.45mm^2 drill.
- 0.0366054 -0.152473 0.987629 vertex 4.4 -2.47561 19.9 vertex.