Labels Milestones
Back7.5 of http://www.st.com/resource/en/datasheet/DM00257211.pdf WLCSP-64, 8x8 raster, 4.539x4.911mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f429ng.pdf UFBGA-201, 15x15 raster, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition Appendix A Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition Appendix A Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double rows Through hole angled pin header, 2x20, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 1x20, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole Samtec HPM power header series 3.81mm post length THT 1x08 1.27mm single row Through hole straight pin header, 2x38, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip THT 1x17 5.08mm single row Surface mounted pin header THT 1x10 1.00mm single row (from Kicad 4.0.7), script generated Through hole angled pin header, 2x16, 1.00mm pitch, double rows Surface mounted socket strip SMD Solder 3-pad Jumper, 1x1.5mm rounded Pads, 0.3mm gap, pads 1-2 Bridged2Bar with 2 copper strip SMD 2x06 2.54mm double row Through hole straight pin header, 1x05, 2.00mm pitch, single row (from Kicad 4.0.7), script generated Through hole pin header SMD 1x20 1.27mm single row Surface mounted socket strip THT 2x01 2.54mm double row SMD IDC box header THT 1x27 1.27mm single row 0.8 mm BGA-64, 10x10 raster, 9x9mm package, pitch 0.5mm; see section 7.3 of http://www.st.com/resource/en/datasheet/stm32l011k3.pdf WLCSP-36, 6x6 raster, 2.605x2.703mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f469ni.pdf WLCSP-180, 13x14 raster, 5.537x6.095mm package, pitch 0.5mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103ze.pdf WLCSP-64, 8x8 raster, 5x5mm package, pitch 0.5mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf UFBGA-144, 12x12 raster, 7x7mm package, pitch 0.8mm TFBGA-121, 11x11 raster, 10x10mm package, pitch 0.4mm.
- 11 Documentation, some cosmetic.
- + 12 + 60 + 24; hole_left.
- Plated contacts, https://www.neutrik.com/en/product/nmj6hfd2-au M Series, 6.35mm.