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Mm Body, 2.00 mm Footprint [HTQFP] thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 932AZ.PDF TQFP128 14x14 / TQFP128 CASE 932BB (see ON Semiconductor 506CE.PDF DD Package; 12-Lead Plastic DFN (7mm x 4mm) (see Linear Technology 05081707_A_DHD16.pdf DH Package; 16-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_16_05-08-1706.pdf DHD Package; 16-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_16_05-08-1709.pdf DHC Package; 18-Lead Plastic DFN (2mm x.

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