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9775026960 (https://katalog.we-online.com/em/datasheet/9775026960R.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 20-Lead Plastic Shrink Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket THT DIP DIL ZIF 10.16mm 400mil 4-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 8-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 16-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 10.8x11.72mm 4x-dip-switch.

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