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UBGA U324 BGA-324 BGA-624, 25x25 grid, 21x21mm package, pitch 0.65mm VFBGA-86, 6.0x6.0mm, 86 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, off-center ball grid, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, 3.0x1.9x0.625mm, 28 ball 7x4 area grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, 7x7mm body (http://www.analog.com/media/en/technical-documentation/data-sheets/AD7951.pdf, http://www.analog.com/en/design-center/packaging-quality-symbols-footprints/symbols-and-footprints/AD7951.html LFCSP-WD, 8 Pin (http://www.ti.com/lit/ds/symlink/lm25085.pdf#page=32), generated with kicad-footprint-generator Hirose DF13 through hole, DF11-22DP-2DSA, 11 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST VH series connector, B13B-EH-A (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DC6 Package; 6-Lead Plastic Dual Flat, No Lead Package - 3x3 mm Body (see Atmel Appnote 8826 10-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_8_05-08-1702.pdf 8-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf QFN Microchip 8E 16 QFN, 44 Pin, dual row male, vertical entry, strain relief clip Harwin LTek Connector, 18 pins, single row style2 pin1 right Through hole angled pin header, 2x30, 2.54mm pitch, 8.51mm socket length, single row style2 pin1 right Through hole angled pin header SMD 2x20 1.00mm double row Through hole Samtec HPM power header series 3.81mm post length THT 1x03 2.00mm single row Surface mounted pin header THT 1x40 1.00mm single row style2 pin1 right Through hole straight pin header, 1x33, 2.54mm pitch, single row (from Kicad 4.0.7), script generated Through hole straight pin header, 1x10, 1.00mm pitch, single row Through hole angled pin header, 1x06, 1.00mm pitch, single row style2 pin1 right Through hole angled socket strip THT 1x23 2.54mm single row Through hole straight socket strip, 2x41, 1.27mm pitch, 4.4mm socket length, double rows Through hole vertical IDC box header 2x08 2.54mm double row Through hole socket strip SMD 2x13 1.27mm double row Through hole socket strip THT 2x01 1.27mm double row surface-mounted straight pin header, 2x18, 2.00mm pitch, 6.35mm socket length, double rows Surface mounted pin header THT 1x03 2.00mm single row Surface mounted pin header SMD 2x23 2.00mm double row Through hole straight Samtec HPM power header series 11.94mm post length, 1x03, 5.08mm pitch, see http://www.vishay.com/docs/88606/g3sba20.pdf Vishay GBU rectifier diode bridge Vishay KBU rectifier diode bridge Thermal enhanced ultra thin SMD package; 3 leads; body: 4.3x6.1x0.43mm, https://www.vishay.com/docs/95570/to-277asmpc.pdf 3-pin TSOT23 package, http://cds.linear.com/docs/en/packaging/SOT_8_05-08-1637.pdf Texas Instrument DRT-3 1x0.8mm Pitch 0.7mm Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, NSMD pad definition Appendix A Kintex-7 and Zynq-7000 BGA.

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