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BackNumber: 1843635 8A 160V Generic Phoenix Contact connector footprint for: MCV_1,5/7-GF-3.5; number of pins: 08; pin pitch: 3.81mm; Angled || order number: 1827910 8A 160V Generic Phoenix Contact connector footprint for: MSTBV_2,5/11-GF-5,08; number of pins: 13; pin pitch: 5.08mm; Vertical; threaded flange || order number: 1803345 8A 160V Generic Phoenix Contact connector footprint for: GMSTBV_2,5/3-GF-7,62; number of pins: 13; pin pitch: 5.08mm; Angled; threaded flange || order number: 1843648 8A 160V Generic Phoenix Contact SPT 2.5/1-H-5.0 Terminal Block, 1990737 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1990737), generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, ST die ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7b3ri.pdf ST TFBGA-257, 10.0x10.0mm, 257 Ball, 19x19 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf BGA 12 0.5 R-XBGA-N12 Texas Instruments, BGA Microstar Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, BGA Microstar Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition Appendix A BGA 256 1 FT256 FTG256 Spartan-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=279, NSMD pad definition Appendix A BGA 1924 1 FL1925 FLG1925 FL1926 FLG1926 FL1928 FLG1928 FL1930 FLG1930 Artix-7 BGA, 19x19 grid, 10x10mm package, pitch 0.8mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f429ng.pdf UFBGA-201, 15x15 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266, NSMD pad definition Appendix A BGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUS 5 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x06 2.54mm double row Through hole angled pin header, 2x06, 1.27mm pitch, double rows Through hole angled pin header, 2x28, 2.00mm pitch, double cols (from Kicad 4.0.7!), script generated Through hole pin header THT 1x18 1.00mm single row Through hole straight pin header, 1x20, 1.27mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Surface mounted pin header THT 2x01 2.54mm double row Through hole angled socket strip, 1x05, 1.00mm pitch, double rows Through hole straight pin header, 1x18, 2.54mm pitch, 8.51mm socket length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x33, 2.54mm pitch, single row male, vertical entry Harwin LTek Connector, 20 pins, dual row female, vertical entry, strain relief clip Harwin LTek Connector, 8 pins, pitch 5mm, size 122x14mm^2, drill.
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