Labels Milestones
BackDIP reed relay series, see https://standexelectronics.com/wp-content/uploads/datasheet_reed_relay_DIP.pdf DIL DIP PDIP 2.54mm 7.62mm 300mil Socket 4-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 64-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 40-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET MC MOSFET Infineon DirectFET S1 MOSFET Infineon PLCC, 20 pins, single row Through hole angled pin header, 1x26, 1.00mm pitch, 2.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header THT 1x33 2.54mm single row Through hole IDC header, 2x17, 2.54mm pitch, 6mm pin length.
- 1 6.95595 7.79002 vertex 1 7.12044 7.60042 vertex.
- Electronics 9776070960 (https://katalog.we-online.com/em/datasheet/9776070960.pdf), generated with.