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SMDIP 2.54mm 9.53mm 375mil 4-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 8x-dip-switch SPST Omron_A6H-8101, Slide, row spacing 15.24 mm (600 mils 48-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 12x-dip-switch SPST CTS_Series194-12MSTN, Piano, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 6x-dip-switch SPST , Piano, row spacing 15.24 mm (600 mils 64-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils SMD DIP Switch SPST Slide 8.61mm 338mil SMD LowProfile JPin SMD 9x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), Socket, LongPads THT DIP DIL PDIP SMDIP 2.54mm 7.62mm 300mil 2x-dip-switch SPST Omron_A6S-210x, Slide, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 12x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see https://www.power.com/sites/default/files/product-docs/lnk520.pdf Power Integrations E Package eSIP-7F Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations variant of 8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf QFN, 64 Pin (https://www.nxp.com/docs/en/package-information/SOT414-1.pdf), generated with kicad-footprint-generator Connector Phoenix Contact connector footprint for: MC_1,5/5-GF-3.5; number of pins: 11; pin pitch: 5.00mm; Vertical || order number: 1843350 8A.

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