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Via insulated copper area below body, vias included (case drawing: https://ww2.minicircuits.com/case_style/MMM168.pdf, land pattern PL-230, including GND vias (https://ww2.minicircuits.com/pcb/98-pl012.pdf.

6.4137 -0.394998 7.51797 facet normal -0.334152 -0.539147 0.773086.
Activities other than the SPDT.
D="m 2.9527508,8.8202247 v 0.07874" d="m -2.5196841,2.5590618.
Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=23 FBGA-96, 13.5x7.5mm, 96 Ball, 9x16 Layout.

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