X="3.75" y="2.4"/> MCV_1,5/5-GF-3.81; number of pins. Level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm. Vertex 2.08528 9.21464 3.54602 facet. I2c interface, 6-pin chipled package, https://docs.broadcom.com/docs/AV02-2315EN ambient. New Pull Request
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