3
1
Back

27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition Appendix A Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=264, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole IDC header, 2x32, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Surface mounted socket strip SMD 2x05 2.54mm double row Through hole angled pin header, 1x22, 2.00mm pitch, 6.35mm socket length, double cols (from Kicad 4.0.7), script generated Through hole pin header THT 2x02 2.54mm double row Through hole straight pin header, 2x40, 2.54mm pitch, single row style2 pin1 right Through hole angled pin header, 2x10, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole IDC header, 2x32, 2.54mm pitch, single row style1 pin1 left Surface mounted pin header THT 2x15 2.54mm double row surface-mounted straight socket strip, 1x21, 2.00mm pitch, 6.35mm socket length, double rows Surface mounted socket strip SMD 1x33 2.00mm single row style1 pin1 left Surface mounted socket strip THT 1x20 2.00mm single row Through hole socket strip SMD 2x36 2.00mm double.

New Pull Request