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BackK Package PowerPAK SO-8 Single (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72599/72599.pdf 16-Lead Plastic Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf DFN package size 11.5x8.5x17.5mm^3, https://www.recom-power.com/pdf/Innoline/R-78Bxx-2.0.pdf dc-dc recom buck sip-12 pitch 2.54mm length 3.04mm diameter 1.6mm wire loop as test point, loop diameter 3.8mm, hole diameter 0.5mm test point SMD pad as test Point, diameter 4.0mm Plated Hole as test point, loop diameter2.6mm, hole diameter 1.2mm THT rectangular pad as test Point, diameter 1.0mm wire loop as test Point, diameter 2.0mm wire loop bead wire loop wire loop with bead as test point, loop.
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