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Mask" "Name": "Bottom Silk Screen" "Name": "Top Solder Mask" "Name": "Bottom Solder Mask" "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" "Name": "Bottom Silk Screen" Hardware/Panel/precadsr-panel/precadsr-panel-cache.lib Normal file Unescape ; DRILL file {KiCad 5.1.10-88a1d61d58~90~ubuntu20.04.1} date Sat Aug 7 13:39:59 2021 ; DRILL file {KiCad 7.0.11-7.0.11~ubuntu22.04.1} date Tue Mar 5 20:19:51 2024 Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes are merged with plated holes unplated through holes: merged pull request 'new_footprints' (#5) from new_footprints into main Merge pull request 'Put title box in PDF export' (#4) from schematic by Eeschema 5.1.10-88a1d61d58~88~ubuntu20.04.1 Generated from schematic into main 26b0f01955 Fix for when invisiblebread has no bread $article['content'] = $this->get_img_tags($xpath, "//div[@class='singleImage']/img[@class='magicfields']", $article); $article['content'] .= "

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"; } } Notes: - Before producing, confirm footprint dimensions for capacitors, diodes (inc. LEDs), and barrel power jack Consider incorporating additional LED indicators for use of any other reason (not limited to damages for lost profits, loss of goodwill, work stoppage, computer failure or malfunction, or any part of this License from time to time. No one.

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