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BackST WLCSP-52, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, http://www.latticesemi.com/view_document?document_id=213 Analog Devices KS-4, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/sc70ks/ks_4.pdf Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf LFCSP 8pin Pitch 0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_8_6.pdf LFCSP 8pin Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments HSOP 9, 1.27mm pitch, single row style1 pin1 left Surface mounted socket strip SMD 2x20 1.00mm double row Through hole angled pin header SMD 1x29 2.54mm single row Surface mounted socket strip SMD 1x40 2.00mm single row Through hole angled pin header, 2x08, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip SMD 2x04 1.27mm double row surface-mounted straight pin header, 1x19, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header THT 1x02 5.08mm single row style2 pin1 right Through hole vertical IDC box.
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