Labels Milestones

Back

8-pin HTSOP package with missing pin 5, row spacing 15.24 mm (600 mils 64-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 4x-dip-switch.

• Repeat a pattern of.
• Mm, 734-162 , 2 pins, Rectangular size 5.0x2.0mm^2.

New Pull Request

0 Open 0 Closed

Label

Show archived labels

Use alt + click/enter to exclude labels

All labels No label

Milestone

All milestones No milestones

Project

All projects No project

0 Open 0 Closed

Close

Label

Clear labels

Milestone

No milestone

Projects

Clear projects