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Https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=284, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=84, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=304, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole angled socket strip, 1x15, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 2x39, 2.54mm pitch, double rows Through hole angled socket strip, 1x36, 2.00mm pitch, 6.35mm socket length, double rows latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole pin header THT 2x29 1.27mm double row Through hole horizontal IDC box header, 2x06, 1.00mm pitch, single row Through hole straight pin header, 1x22, 1.00mm pitch, double rows Surface mounted pin header THT 1x21 1.27mm single row style2 pin1 right Through hole straight pin.

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